IP & Cores
Using Machine Learning to Verify and Produce Timing Libraries 100X Faster for Digital Design and Signoff
Wei-Lii Tan, Product Manager, Mentor, A Siemens Business
Learn why eFPGA Adoption is Taking Off & How your SoC Can Benefit
Andy Jaros, VP Sales & Solutions Architecture, Flex Logix
-->> view recording on YouTube <<--
Enabling AI SoCs, using Power-Efficient IPs for “Automotive/IoT/Edge” Applications
Farzad Zarrinfar, Farzad Zarrinfar, Managing Director, IP Division, Mentor, a Siemens Business
Application Optimized IP(TM) Improves Overall System Level Performance
Mo Faisal, CEO & Co-founder, Movellus
-->> view recording on YouTube <<--
FDSOI and FINFET Solutions for ESD and Analog I/Os
Koen Verhaege, Koen Verhaege, CEO, SOFICS
-->> view recording on YouTube <<--
Menta eFPGA Technology For a Changing World
Imen Baili, Sales Application Engineer, Menta
-->> view recording on YouTube <<--
Compilers and Developer Tools For Custom Software Programmable IPs
Ayonam Ray, Director, R. R. Logic Systems
-->> view recording on YouTube <<--
Analog IP: A New Approach Using Design Automation
Andrew Farrugia, VP Marketing, Agile Analog
-->> view recording on YouTube <<--
IP Reuse - Understanding and Efficiently Tackling Process Technology Differences and its Impact on Circuit Functionality
Sowmyan Rajagopalan, Founder & CTO, Thalia
-->> view recording on YouTube <<--
High-speed Data Converters For 5G and LiDAR
Hyun Boo, Hyun Boo, Co-founder, Senior Director Product Management, Omni Design Technologies
-->> view recording on YouTube <<--
IP Lifecycle Management
Michael Munsey, Vice President, Marketing and Corporate Strategy, Methodics
-->> view recording on YouTube <<--
Flexible Clocking Solutions in Advanced FinFet Processes From 16nm to 5nm
Andrew Cole, VP Business Development, Silicon Creations
-->> view recording on YouTube <<--
Innovation trends in Analog IO design for high bandwidth interconnects, Automotive and IoT Applications
Abhijit Dutta, Head of Mixed Signal Solutions, HCL Technologies
-->> view recording on YouTube <<--
Test & Package
Advanced IC Packaging Design & Verification Challenges
Keith Felton, Marketing Manager, Xpedition High Density Advanced Packaging
Mentor, a Siemens Business
-->> view recording on YouTube <<--
Addressing ISO 26262 test requirements with the “Tessent Safety Ecosystem”
Lee Harrison, Marketing Manager for Automotive IC Test Solutions, Mentor, A Siemens Business
Advanced IC Packaging and Co-Design Solutions with Zuken Design Force
Iyad Rayane, European Technical solution's architect for the 3D-IC/Advanced Packaging and Co-Design Environment
Zuken
-->> view recording on YouTube <<--
Lifetime Prediction and Qualification from MTOL, not HTOL!
Joseph Bernstein, Professor, Ariel University
-->> view recording on YouTube <<--
Front-end Design & Verification
Exploring Next Generation SoC Architectures with Virtual Platforms and RISC-V
Kevin McDermott, VP Marketing, Imperas Software Ltd.
-->> view recording on YouTube <<--
Achieving the Single Iteration Fault Campaign for Automotive IC’s
Ann Keffer, Product Management – Functional Safety, Mentor, a Siemens Business
Static Sign-Off: How Shifting Left & Multimode Tools Improve Design Efficiency
Oren Katzir, VP, Applications Engineering & Business Development, Real Intent
My code is Clean Starting Today!
Alex Marin, RnD Team Leader, AMIQ
Overcoming Challenges in SoC RTL Verification of USB Subsystem
Tijana MISIC, Senior SoC DV Engineer, Elsys Eastern Europe
Machine Learning Based Solutions in JasperGold
Habeeb Farah, Software engineering group director, Cadence Design Systems
-->> view recording on YouTube <<--
